This presentation provides an introduction and overview of Low Temperature Soldering, a breakthrough technology for greener electronics that can enable faster technology scaling while reducing carbon emissions and electricity costs.
Intel’s ESD prevention methods prevent costly damage to electronic devices.
Demos removing and replacing damaged ball grid array socket components for motherboard repair.
Bill Giard of Intel and Bryant Eadon of StrongArm discuss the drivers and barriers for hybrid cloud adoption.
Bob Rogers shares how companies are using advanced analytics and AI. He describes key imperatives to help achieve success.
See how Intel uses knowledge-based qualification to qualify products in unique usage environments.