This presentation provides an introduction and overview of Low Temperature Soldering, a breakthrough technology for greener electronics that can enable faster technology scaling while reducing carbon emissions and electricity costs.
PoP device rework demos thermal reflow profile, PCB pad site, and new component preparation.
Demos removing and replacing damaged ball grid array socket components for motherboard repair.
Intel’s ESD prevention methods prevent costly damage to electronic devices.
Bill Giard of Intel and Bryant Eadon of StrongArm discuss the drivers and barriers for hybrid cloud adoption.
See how Intel uses knowledge-based qualification to qualify products in unique usage environments.