Guide: Document provides overview of board flexure control methodology, board preparation, Intel(r) BFI metrics, component determinations, with motherboard assembly line strain measurement, flexure reductions, test planning, and general procedures.
Chen Han Lim demos a solution that collects machine data in a mobile app for manufacturing efficiency.
How real-time factory big data enables smarter decision making and performance with new opportunity.
PoP device rework demos thermal reflow profile, PCB pad site, and new component preparation.
Demos removing and replacing damaged ball grid array socket components for motherboard repair.
Intel’s ESD prevention methods prevent costly damage to electronic devices.