Intel IT has used design best practices to convert a 5,000-square-foot wafer fabrication facility into a high-density data center, achieving the following results:

• A rack power density (up to 43 kW per rack) that is 1.5 times greater than what we have delivered in the past for high-density computing
• The ability to use only free-air cooling except for 39 hours or less per year and to run our servers at an air intake temperature of up to 95°F (35°C)
• An 1,100 watts per square foot cooling density and a 1,300 watts per square foot electrical density (10 times the industry average)

Our newly designed data center has a total power capacity of three legacy data centers. The commodity Intel® architecture-based servers installed in this facility offer 51 percent higher performance per core than previous models, which enables us to significantly increase compute density. The higher cooling and electrical density will enable us to support the large growth in compute demand associated with electronic design automation tools. This growth is a result of an increase in circuit design complexity and the workload required for comprehensive silicon design and testing.