Intel® Communications Chipset 89xx Series: Design Guide

Intel® Communications Chipset 89xx Series: Design Guide

Intel® Communications Chipset 89xx Series: Design Guide

Power dissipation requirements for electronic components have risen with the increase in complexity of computer systems. To ensure quality, reliability, and performance goals are met over a product's life cycle, the heat generated by the component must be properly dissipated. Typical methods to improve heat dissipation include selective use of airflow ducting, and/or the use of heatsinks.

Sistema integrado e Internet de las cosas


Encuentre documentación detallada, herramientas y recursos para desarrolladores integrados y de Internet de las cosas.

Comuníquese con Intel


Acceda a asistencia técnica y de ventas, regístrese para una cuenta o administre su cuenta.

Videos relacionados