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Intel® Xeon® Processor E5-1600/2600/4600 Product Families Thermal / Mechanical Design Guide

Intel® Xeon® Processor E5- 1600/2600/4600 Product Families: Guide

Introduction

This document provides guidelines for the design of thermal and mechanical solutions for the:
• Intel® Xeon® Processor E5-1600 and E5-2600 Product Families

Processors in 2 and 4-socket servers, and 2-socket workstations in the Intel® Xeon® Processor 5-1600/E5-2600/E5-4600 Product Families-based platform. The processors covered are listed in the processor family datasheets. The components described in this document include:
• The processor thermal solution (heatsink) and associated retention hardware
• The LGA2011-0 socket, the Independent Loading Mechanism (ILM) and back plate

The goals of this document are:
• To assist board and system thermal mechanical designers
• To assist designers and suppliers of processor heatsinks
Thermal profiles and other processor specifications are provided in the appropriate processor datasheet.
Read the full Intel® Xeon® Processor E5- 1600/2600/4600 Product Families: Guide http://www.intel.com/content/www/us/en/chipsets/c600-series-chipset-thermal-guide.html

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