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Remote Graphics Performance: Intel® Xeon® Processor E3-1200 v4

Shows configuration details for 3DMark* 11 performance with the Intel® Xeon® processor E3-1200 v4 product family.

Guía para socios de Data Centers de HPC

Guía para socios de Data Centers de HPC.

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Familia de centros de datos para Intel® SSD

Maximice el suministro de desempeño, reduzca el consumo de energía y disminuya los costos operativos con la familia de centros de datos con SSD Intel®, diseñada para cargas de trabajo de almacenamiento intensas.

Wearable Medical Devices, Big Data & Parkinson’s Disease Research

Learn how wearable medical devices are advancing Parkinson’s research through the collection and analysis of data that has never been seen before.

Taking Oil and Gas Exploration to the Next Level

Case Study: DownUnder GeoSolutions speeds up oil and gas exploration with an Intel® Xeon® processor E5-2600 v2 product family-based HPC platform.

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Non-Volatile Memory

3D XPoint™ is a new breakthrough in non-volatile memory technology enabling memory-like performance at storage-like capacity and cost.

Intel's Packaging Databook Chapter 8: Moisture Sensitivity/Desiccant Packaging/PSMCs Handling

Packaging Databook, Chapter 8: Moisture sensitivity/desiccant packaging/PSMCs handling.

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Intel's Packaging Databook Chapter 9: SMT Board Assembly Process Recs

Packaging Databook, Ch.9: solder paste printing, component placement, reflow soldering, and rework.

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Intel's Packaging Databook Chapter 10: Shipping and Transport Media

Packaging Databook, Ch. 10: product and transport media, environmental programs, tape and reel, protective bands, and shipping formats.

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Intel's Packaging Databook Chapter 12: Tape Carrier Package

Packaging Databook, Ch. 12: Profile of the Tape Carrier Package and its uses in areas that require lightweight small footprint integrated circuits.

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