Shows configuration details for 3DMark* 11 performance with the Intel® Xeon® processor E3-1200 v4 product family.
Shows remote graphics performance solutions with the Intel® Xeon® processor E3-1200 v4 product family, which offers cost-efficient and dense designs to enable global workforce collaboration in delivery of complex 3D applications.
Maximice el suministro de desempeño, reduzca el consumo de energía y disminuya los costos operativos con la familia de centros de datos con SSD Intel®, diseñada para cargas de trabajo de almacenamiento intensas.
Maximice el suministro de desempeño, reduzca el consumo de energía y disminuya los costos operativos con la familia de centros de datos con unidades de estado sólido Intel®, diseñada para cargas de trabajo de almacenamiento con uso intensivo de lectura y escritura a velocidades predecibles, para un funcionamiento de centros de datos confiable y fluido.
Learn how wearable medical devices are advancing Parkinson’s research through the collection and analysis of data that has never been seen before.
In a collaborative effort to speed up breakthroughs in drug development, the Michael J Fox Foundation is using Intel’s wearable medical devices to advance Parkinson’s research through collection and analysis of data that has never been seen before.Vista completa >
Case Study: DownUnder GeoSolutions harnesses the power of high-performance computing on an Intel® Xeon® processor E5-2600 v2 product family and Intel® Xeon Phi™ coprocessor-based platform to fast-track oil and gas exploration for their clients.
3D XPoint™ is a new breakthrough in non-volatile memory technology enabling memory-like performance at storage-like capacity and cost.
A new breakthrough in non-volatile memory technology, Intel® 3D XPoint™ offers memory-like performance at storage-like capacity and cost for more affordable multi-terabyte memory arrays and faster SSD storage.
Packaging Databook, Chapter 8: Moisture sensitivity/desiccant packaging/PSMCs handling.
Discusses surface mount assembly processes, preconditioning flows and moisture absorption, thermal stress, and typical chemical environments. Also covers standardized moisture sensitivity levels and handling, packing, and shipping requirements.
Packaging Databook, Ch.9: solder paste printing, component placement, reflow soldering, and rework.
Packaging Databook, Ch. 9: SMT Board Assembly Process Recs
Packaging Databook, Ch. 10: product and transport media, environmental programs, tape and reel, protective bands, and shipping formats.
Chapter 10 Transport Media and Packing: Various packing and shipping methods used at Intel. Packing media, desiccant pack materials, and shipping data are illustrated.
Packaging Databook, Ch. 12: Profile of the Tape Carrier Package and its uses in areas that require lightweight small footprint integrated circuits.
Chapter 12 Tape Carrier Package: A profile of the Tape Carrier Package and its uses in areas that require lightweight small footprint integrated circuits.