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Cave Creek Chipset: Mechanical Package

Mechanical Package: Provides the Orcad* and Concept* symbols as well as the pin locations for the Cave Creek chipset.

Intel® Xeon® Processor 5100 Series: Thermal Guide

Guide: Thermal solutions and design parameters for the dual-core Intel® Xeon® processor 5100 series that demonstrate processor cooling features.

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Intel® Xeon® Processor i3-2115 C: Power Guideline Addendum

Power Guideline Addendum: Provides power numbers on the Intel® Xeon® processor i3-2115 C while running real life applications. (v.001, Aug. 2012)

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Intel® Communications Chipset 8920: Power Guide Addendum

Addendum: Provides power consumption information on the Intel® Communications Chipset 8920 while it is running on industry standard applications.

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Application Power Guideline for Intel® Embedded Processors

White Paper: Application Power Guidelines based on realistic power consumption estimates for Intel® Embedded processors. (v.001, Dec. 2010)

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Multi-Core Processor Performance Optimization

Sarma Vrudhula of Arizona State University presents research on multi-core processor performance optimization under thermal constraints.

Intel® Core™2 Duo Processor E8000/E7000 Series: Thermal Guide

Guide: Thermal solutions and design parameters for the dual-core Intel® Core™2 Duo processor E8000/E7000 series that demonstrate cooling features.

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Intel® Communications Chipset 89xx Series AMC Reference Design Kit

crystal-forest-amc-chipset-89xx-seriesreference-design-kit

Intel® Xeon® Processor E5-2600 v2 Series: Power Guidelines

Guidelines: Provides power data for the Intel® Xeon® processor E5-2600 v2 series while running real-life applications. (v.1, Aug. 2013)

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Intel® Atom™ LEAP* Platform: Energy-Efficient Embedded Computing

Reiher and Kaiser, UCLA, discuss Intel® Atom™ LEAP* architecture and embedded systems instructions for energy efficiency.