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Intel's Packaging Databook Chapter 4: IC Packages Performance Characteristics: Packaging

Packaging Databook, Ch. 4: basic package modeling terminology, methodology, and experimental characterization, and modeled data for the packages.

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Intel's Packaging Databook Chapter 6: ESD/EOS

Packaging Databook, Ch. 6: Electrical static discharge and electrical over stress.

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Intel® Silicon View Technology

See processor capabilities that make it easier to test and diagnose platform debug, electrical validation, and board manufacturing testing challenges.

Intel® Silicon View Technology

See processor capabilities that make it easier to test and diagnose platform debug, electrical validation, and board manufacturing testing challenges.

Intel® Xeon® Processor MP with 1MB L2 Cache Datasheet

Intel® Xeon® processor MP with 1MB L2 Cache.

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IT@Intel Tests the Intel® Xeon® E5 Processor Family in Design Center

In IT@Intel’s design center, the Intel® Xeon® processor E5 family test team deploys rigorous tests for performance and efficiency measurements.

Design Guide: mPGA604 Socket for Intel® Xeon® Processors

Mechanical Design Guide: mPGA604 Socket covers documentation, safety, mechanical, electrical, and validation requirements.

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Intel® Xeon® Processor 3000 Series: Datasheet

Combines performance of previous generation products with the power efficiencies of a low-power microarchitecture to enable smaller, quieter systems.

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Intel® Xeon® Processor 3000 Series Specification Update

Specification Update: provides updated information for previously-published Intel® Xeon® Processor 3000 Series Datasheet.

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Intel® Xeon® Processor 3000 Series Thermal/Mechanical Design Guide

Datasheet: provides thermal specifications and guidelines for systems using Intel® Xeon® processor 3000 series.

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