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Intel's Packaging Databook Chapter 4: IC Packages Performance Characteristics: Packaging

Packaging Databook, Ch. 4: basic package modeling terminology, methodology, and experimental characterization, and modeled data for the packages.

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Intel's Packaging Databook Chapter 6: ESD/EOS

Packaging Databook, Ch. 6: Electrical static discharge and electrical over stress.

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Intel® Xeon® Processor MP with 1MB L2 Cache Datasheet

Intel® Xeon® processor MP with 1MB L2 Cache.

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Design Guide: mPGA604 Socket for Intel® Xeon® Processors

Mechanical Design Guide: mPGA604 Socket covers documentation, safety, mechanical, electrical, and validation requirements.

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Intel® Socket Test Technology for LGA771

This document includes the theory on which Intel® Socket Test Technology is based, typical test methods, and device specification for LGA771.

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Chipset Intel® E7501

El chipset Intel® E7501 es compatible con sistemas para servidores con doble procesador optimizados para el procesador Intel® Xeon®.

Recursos técnicos para los procesadores Intel® Xeon®

Recursos técnicos para la familia de procesadores Intel® Xeon® y la familia de productos Intel® Xeon Phi™, que incluye hojas de datos, notas sobre el producto y mucho más.

Hitachi Unified Compute Platform* with Intel® Xeon® Processors

Solution Brief: The Intel® Xeon® processor-based Hitachi Unified Compute Platform* IT solutions reduce costs and improve performance for big data.

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Ebay’s Analytics and Business Intelligence

Ebay’s Dan Morales discusses real-time predictive analytics and business opportunities enabled by Cisco and the latest Intel® Xeon® processors.

Intel® Xeon® Processor E7 v2 Family: Predictive Analytics

Intel Product Line Manager Ryan Rodman demos the speed and predictive analytics capabilities of the Intel® Xeon® processor E7 v2 family for SAP HANA*.