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Intel® Socket Test Technology for LGA771

This document includes the theory on which Intel® Socket Test Technology is based, typical test methods, and device specification for LGA771.

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Mercados de capitales: Soluciones bancarias multicanal de Intel

Intel ofrece soluciones que permiten proporcionar servicios bancarios multicanal en cualquier momento y lugar, con lo cual las entidades bancarias pueden mantenerse comunicadas con sus clientes a través de diversos canales.

Capital Markets: Low-Latency Trading

The new generations of Intel® processors help reduce latency, giving financial firms the edge they need for split-second trading.

Capital Markets: Risk Management Technology from Intel

Intel’s processors improve risk management technology by helping firms access, store, and analyze large amounts of data to make better decisions.

Case Study: Kingdom Stock and Intel: Meeting Stock Market Needs

Kingdom Stock Transaction System support with a reliable, secure, high-performance solution based on the Intel® Xeon® processor E7 family.

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Intel® Xeon® Processor E7 Family Accelerates Real-Time Analysis

Case Study: NTT Data Corporation builds social infrastructure services by accelerating real-time analysis using the Intel® Xeon® processor E7 family.

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Intel's Packaging Databook Chapter 2: Package/Module/PC Card Outlines

Chapter 2 Package / Module / PC Card Outlines and Dimensions: A detailed view of Intel package outlines and dimensions.

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Intel's Packaging Databook Chapter 3: Alumina and Leaded Molded Technology: Packaging

Packaging Databook, Ch. 3: packaging technologies for assembling three types of component packages for alumina and leaded molded technology.

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Intel's Packaging Databook Chapter 4: IC Packages Performance Characteristics: Packaging

Packaging Databook, Ch. 4: basic package modeling terminology, methodology, and experimental characterization, and modeled data for the packages.

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Intel's Packaging Databook Chapter 5: Physical Constants of IC Package Materials

2000 Packaging Databook, Chapter 5: Physical constants of IC package materials.

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