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Chipset Intel® E8870

El chipset Intel® E8870, con el componente E8870SP, permite configuraciones de nodos múltiples de hasta ocho procesadores Intel® Itanium®.

Intel's Packaging Databook Chapter 2: Package/Module/PC Card Outlines

Chapter 2 Package / Module / PC Card Outlines and Dimensions: A detailed view of Intel package outlines and dimensions.

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Intel's Packaging Databook Chapter 4: IC Packages Performance Characteristics: Packaging

Packaging Databook, Ch. 4: basic package modeling terminology, methodology, and experimental characterization, and modeled data for the packages.

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Intel's Packaging Databook Chapter 5: Physical Constants of IC Package Materials

2000 Packaging Databook, Chapter 5: Physical constants of IC package materials.

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Intel's Packaging Databook Chapter 6: ESD/EOS

Packaging Databook, Ch. 6: Electrical static discharge and electrical over stress.

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Intel's Packaging Databook Chapter 10: Shipping and Transport Media

Packaging Databook, Ch. 10: product and transport media, environmental programs, tape and reel, protective bands, and shipping formats.

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Intel's Packaging Databook Chapter 12: Tape Carrier Package

Packaging Databook, Ch. 12: Profile of the Tape Carrier Package and its uses in areas that require lightweight small footprint integrated circuits.

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Procesadores Intel® Itanium®

Los procesadores Intel® Itanium® ofrecen un sólido desempeño y son compatibles con las aplicaciones comerciales más exigentes de la actualidad.

Intel® E8870 Chipset: Cost-Effectiveness for Scalable Servers

White Paper: Intel® E8870 Chipset has architecture for Intel Itanium® processor-based servers and allows systems to scale from 2-16 processors.

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Procesador Intel® Itanium® serie 9500:

Más información acerca del procesador Intel® Itanium® serie 9500: una poderosa plataforma para la virtualización y consolidación de las cargas