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White Paper: Thermal Design Considerations for Embedded Applications

Thermal Design Considerations for Embedded Applications

Executive Summary
Embedded Applications differ from the typical desktop, server and mobile markets. Some of the different requirements for embedded applications include higher ambient temperatures, need for higher max component temperature spec, low platform power, long life support, small form factors, and extended usage conditions (24 x 7 x 365 operation).
Due to these differences there are special considerations for component and system level thermal solution design. Thermal solution design requires an engineer to fully understand the system and various form factor boundary conditions and component level attributes. This document will define thermal cooling schemes: passive, active and fanless thermal solutions and their difference via the three modes of heat transfer (conduction, convection, and radiation). The thermal performance metrology will be explained, using a thermal resistance calculation and how to apply to Intel components.
The methodology will highlight typical Intel component specifications such as TJ-MAX, TCASE-MAX, TAMBIENT and Thermal Design Power (TDP). In addition some thermal features such as the Digital Thermal Sensor (DTS) and Thermal Monitor will be explained.

Read the full Thermal Design Considerations for Embedded Applications White Paper.

Thermal Design Considerations for Embedded Applications

Executive Summary
Embedded Applications differ from the typical desktop, server and mobile markets. Some of the different requirements for embedded applications include higher ambient temperatures, need for higher max component temperature spec, low platform power, long life support, small form factors, and extended usage conditions (24 x 7 x 365 operation).
Due to these differences there are special considerations for component and system level thermal solution design. Thermal solution design requires an engineer to fully understand the system and various form factor boundary conditions and component level attributes. This document will define thermal cooling schemes: passive, active and fanless thermal solutions and their difference via the three modes of heat transfer (conduction, convection, and radiation). The thermal performance metrology will be explained, using a thermal resistance calculation and how to apply to Intel components.
The methodology will highlight typical Intel component specifications such as TJ-MAX, TCASE-MAX, TAMBIENT and Thermal Design Power (TDP). In addition some thermal features such as the Digital Thermal Sensor (DTS) and Thermal Monitor will be explained.

Read the full Thermal Design Considerations for Embedded Applications White Paper.

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