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Power Profiling for Embedded Applications

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Power Profiling for Embedded Applications

Executive Summary
Today’s embedded customers are becoming more and more conscious of how much power their platforms consume. In an effort to reduce overall global power consumption and in turn minimize a business’s carbon footprint, companies must optimize their hardware and software computing solutions to run more efficiently. Intel’s Embedded and Communications Group (ECG) developed a new power profiling kit which can accurately measure a platform’s total AC, DC, and component level power consumption while running standard applications or benchmarks.
Armed with this data, embedded system designers can take advantage of various power saving Intel® architecture features to match the demands put on their systems during peak and off-peak operation.
Power profiling is a method used to measure actual power consumption of the major components within a computing platform by running standard applications and benchmarks. Multiple components rarely run simultaneously at their maximum thermal design power (TDP), hence this procedure tends to provide a more realistic system power estimate and avoid unwarranted conservatism. This paper describes steps in implementing power profiling on an Intel® architecture platform.

Read the full Power Profiling for Embedded Applications White Paper.

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