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Thermal-Mechanical Considerations for In-Vehicle Infotainment

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Thermal-Mechanical Considerations for In-Vehicle Infotainment

Executive Summary

The thermal design power (TDP) for Embedded Menlow is low, approximately 4.5 W for the kit—the lowest kit TDP produced by Intel in recent history, but it is not low enough to overcome thermal issues in some In-Vehicle Infotainment (IVI) applications. Until TDP decreases, another way to meet automotive requirements is to provide package-level thermal enhancements that allow for reliable operation in thermally restrictive IVI systems.

The packaging for Embedded Menlow XL allows for enhanced thermal performance and reliable operation under extreme usage conditions.

To address the thermal-related requirements of IVI, larger packaging of Embedded Menlow was offered, now referred to as Embedded Menlow XL. The processor includes an integrated heat spreader (IHS) which allows the processor to run approximately 14 C cooler, and below specification, in an IVI system. In addition to the thermal enhancements, Embedded Menlow XL also provides:

• An industrial temperature rating of -40 to 85 C, and a higher Tjmax rating of 110 C.

• Mechanical isolation of the critical thermal interface thereby minimizing the risk of TIM1 separation during shock and vibration events.

• Lower cost of ownership; seamless integration into existing manufacturing processes.

Read the full Thermal-Mechanical Considerations for In-Vehicle Infotainment White Paper.

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