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Fanless Cooling for Embedded ApplicationsExecutive SummaryEmbedded market opportunities for Intel® architecture components exist in Point-Of-Sale Terminals, Digital Signage, and Digital Security Surveillance market segments to name a few. When selecting Intel® architecture, several key metrics customers pay attention to include performance/watt, Thermal Design Power (TDP), total cost of ownership, and reliability. The Embedded Computing Group (ECG) offers scalability with Intel® architecture products ranging from full power (35W and up) to low power (10W~15W) to ultra-low power (~5W) Intel® architecture system solutions to address these market segments and requirements. The objective of this white paper is to provide system designers a reference fanless cooling solution for a Point-Of-Sale application.Why a fanless solution? Higher reliability, lower cost, and lower power applications are among the primary selection criteria when considering whether to design a system with or without a fan. Other considerations include smaller form factor requirements, acoustic constraints, and specific working environments. The majority of “off the shelf” thermal solutions are not suitable for adoption in fanless applications; and often experience overheating in the system and/or an over designed thermal solution.This paper will provide emphasis on component level natural convection heatsink characterization and optimization followed by a first level system approximation utilizing a CFD simulation.Read the full Fanless Cooling for Embedded Applications White Paper.
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Overview includes performance, processor, thermal, and system states. (v.001, Aug. 2011)
Intel® Xeon® processors provide power savings, scalability performance, integration, and more.
Technology that puts devices in lower power states when workload decreases. (v.1, Jan. 2011)
Discusses Intel® Atom™ LEAP* architecture and embedded systems instructions for energy efficiency.
Presents research on multi-core processor performance optimization under thermal constraints.